Posted by dapj20 on Feb 08, 2020 in IC-Package
A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.
Electronic Schematic Diagrams
Digital, Analog and Power Designs
A technology innovator in packaging and test solutions. The pakaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions.
Japanese chemical engineering and manufacturing company, headquartered in Tokushima, Japan. Specializes in the manufacturing and distribution of phosphors, including light-emitting diodes (LEDs), battery materials and calcium chloride.
A semiconductor company specializing in design solutions at the microchip level in the areas of wireless communication and multimedia. Nordic Semiconductor ASA is a world leader in high-speed data converters and short-range radio communication.
From the smallest 8-bit to the highest performing 32-bit microcontrollers families. Even derivatives from the foundation chip 80C51.
Fabless semiconductor provider of application-specific standard products, these are used in storage, communications and consumer electronic products.